I spend my days looking inside chip packages to find out why they failed. With X-ray tomography or an acoustic microscope, I can see through a finished package without opening it: every solder bump, every copper trace, every buried layer. It is satisfying detective work. Somewhere along the way, I realized it is also exactly what a reverse engineer does.
I spend my days looking inside chip packages to find out why they failed.
With X-ray tomography or an acoustic microscope, I can see through a finished package without opening it: every solder bump, every copper trace, every buried layer.
It is satisfying detective work.Somewhere along the way, I realized it is also exactly what a reverse engineer does.
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